AMD is aiming its Neo technology at the ultra-thin laptop market. This is the same market that Intel has addressed for a long time with its ULV (ultra-low-voltage) chips. However, until very recently, laptops using Intel's ULV chips were expensive "executive jewelry," as Intel CEO Paul Otellini has described the segment. (Think: $2,000-and-up Sony That was then. Intel now targets its ULV silicon at inexpensive ultra-thin laptops. It's probably safe to say that AMD beat Intel to the punch (and got Intel's attention) when HP announced the 0.9-inch-thick, $700 dv2 laptop at CES in January, sporting the first Neo chip. Advanced Micro Devices will debut its dual-core low-power Athlon chip technology on an updated laptop from Hewlett-Packard next week. This will be followed by "Congo" low-power silicon later this year.The dual-core Neo chip used in the updated HP dv2 (which is exclusive to HP) will be followed by AMD's Congo technology, due in the third quarter, which integrates AMD's HD3200 graphics, an improvement over the current "Yukon" platform. The all-important power envelope--that, after all, is what sets the technology apart from mainstream mobile silicon--of the whole package including the graphics is expected to be about the same as the first-generation Neo, according to AMD.
One of the challenges that AMD faces is benchmarks. This CNET review of the first HP dv2 laptop with the initial Neo chip said that though the "1.6 GHz Neo CPU MV-40 has enough processing power to run Windows Vista smoothly, something that has tripped up Intel-Atom-powered systems" when "running multiple apps simultaneously, none of these low-power, single-core CPUs were particularly impressive, and the Neo and Atom were essentially tied in our multitasking test. By way of comparison, a standard Intel Core 2 Duo ULV (ultra-low voltage) processor, as found in more expensive 12-inch laptops, easily beats them all."
No comments:
Post a Comment